Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC)

Abstract

The paper introduces the context for the emerging area of integrated power conversion. The key applications driving this trend are outlined and the principal competing technologies are presented encompassing system in package, system on chip and embedded substrate solutions. A system-in-package, 30MHz dc-dc converter using a stacked co-packaging approach is demonstrated. Its enabling key elements, including magnetics on Si technology, a power IC with a digital pulse width modulator and on-chip capacitor, and associated packaging techniques are also presented. A maximum measured efficiency of 71.7% is achieved on the stacked converter with a 30% area reduction compared to side-by-side implementation.