Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn–1Ag–0.5Cu solder alloys

Physical chemistry of metals

Raymond L. Smith · Journal of the Franklin Institute · 1953 · 1.3K citations

Natural Sciences, Chemistry, Materials Science +12

Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

Jie Zhao, Lin Qi, Xiumin Wang et al. · Journal of Alloys and Compounds · 2004 · 184 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys

Jun Shen, Yayun Pu, Henggang Yin et al. · Journal of Alloys and Compounds · 2014 · 145 citations

Natural Sciences, Materials Engineering, Materials Science +15

Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties

I. Dutta, Praveen Kumar, Ganesh Subbarayan · JOM · 2009 · 97 citations

Engineering, Materials Engineering, Materials Science +16

Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder

A.A. El-Daly, A. M. El-Taher, T. R. Dalloul · Journal of Alloys and Compounds · 2013 · 80 citations

Natural Sciences, Materials Engineering, Materials Science +17