Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy

Abstract

Directed Self Assembly (DSA) of Block Co-Polymers (BCP) has become an intense field of study as a potential patterning solution for future generation devices. The most critical challenges that need to be understood and controlled include pattern placement accuracy, achieving low defectivity in DSA patterns and how to implement this process as a patterning solution. The DSA program at imec includes efforts on these three major topics. Specifically, in this paper the progress for the templated DSA flow within the imec program will be discussed. An experimental assessment is made based on a 37 nm BCP pitch material. In particular, the impact of different process options is illustrated, and data for CD and placement accuracy of the DSA holes in their template is provided.