Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bonding

Contact Resistance and Contact Resistivity

H.H. Berger · Journal of The Electrochemical Society · 1972 · 500 citations

Engineering, Electrical Engineering, Materials Science +17

The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics

G. G. Harman, John Albers · IEEE Transactions on Parts Hybrids and Packaging · 1977 · 203 citations

Natural Sciences, Materials Engineering, Materials Science +16

A direct measurement of interfacial contact resistance

S.J. Proctor, L.W. Linholm · IEEE Electron Device Letters · 1982 · 140 citations

Engineering, Electrical Engineering, Materials Science +17

Ultrasonic wire-bond quality monitoring using piezoelectric sensor

Siu Wing Or, H.L.W. Chan, Veng Cheong Lo et al. · Sensors and Actuators A Physical · 1998 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +14

The Microelectronic Wire Bond Pull Test-How to use It, How to Abuse It

G. G. Harman, Colin P. Cannon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1978 · 50 citations

Engineering, Electrical Engineering, Materials Science +17