Key engineering materials · 2010 · 10 citations · 4 references
EngineeringMaterials EngineeringMaterials ScienceMaterials ProcessingSurface ChemistrySurface ScienceSemiconductor SurfacesSurface Chemistry Of SolidsSurface FinishingSurface ModificationSurface PreparationSurface TreatmentAbrasive ParticlesLappingLapping ProcessesPlanarizationPlanarization TechniquesPolishingSilicon CarbideSubstrate Lapping
We have developed advanced lapping and polishing methods for silicon carbide (SiC) substrates using an Fe abrasive particles and hydrogen peroxide (H2O2) solution. In this method, a SiC surface is oxidized by hydroxyl radicals (OH*), which was generated by Fe catalyst reactions, and the oxide layer on the SiC is mechanically and/or chemically removed by Fe abrasive particles and solution [1-4]. In this study, we applied this planarization method for lapping and polishing SiC surface, in which catalytically generated hydroxyl radicals were utilized to oxidize the surface of a SiC wafer. The processed surfaces were observed by optical interferometric microscope, Nomarski differential interference contrast. These observations showed that surface roughness and flatness of a SiC substrate were markedly improved and scratch-free SiC surface was obtained. These results provide useful information for preparing a high-efficiency and high-accuracy SiC substrate.
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