Investigation on S-136 steel surface planarization by chemical mechanical polishing

Material removal mechanism in chemical mechanical polishing: theory and modeling

Jianfeng Luo, David Dornfeld · IEEE Transactions on Semiconductor Manufacturing · 2001 · 641 citations

Engineering, Materials Engineering, Materials Science +16

Chemical mechanical planarization for microelectronics applications

Parshuram B. Zantye, Ashok Kumar, A. K. Sikder · Materials Science and Engineering R Reports · 2004 · 612 citations

Engineering, Materials Engineering, Materials Science +14

A micro-contact and wear model for chemical–mechanical polishing of silicon wafers

Yongwu Zhao, L. Chang · Wear · 2002 · 301 citations

Engineering, Materials Engineering, Materials Science +16

Chemical mechanical polishing of thin film diamond

Evan L. H. Thomas, Geoffrey W. Nelson, Soumen Mandal et al. · Carbon · 2013 · 179 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Modification of the Preston equation for the chemical–mechanical polishing of copper

Qiuliang Luo, S. Ramarajan, S. V. Babu · Thin Solid Films · 1998 · 168 citations

Natural Sciences, Materials Engineering, Materials Science +11