Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Materials Engineering, Materials Science +16

Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives

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Engineering, Materials Engineering, Materials Science +14

Transport Phenomena That Control Electroplated Copper Filling of Submicron Vias and Trenches

Ken Takahashi, M. E. Gross · Journal of The Electrochemical Society · 1999 · 88 citations

Engineering, Electrical Engineering, Materials Science +17

Leveling of 200 nm Features by Organic Additives

James J. Kellya · Electrochemical and Solid-State Letters · 1999 · 87 citations

Natural Sciences, Chemistry, Materials Science +14

Copper electroplating for future ultralarge scale integration interconnection

W. C. Gau, T. C. Chang, Yung‐Hsiang Lin et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2000 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +17