Ken Takahashi

Transport Phenomena That Control Electroplated Copper Filling of Submicron Vias and Trenches

Ken Takahashi, M. E. Gross · Journal of The Electrochemical Society · 1999 · 88 citations

Materials Science, Electrical Engineering, Electromigration Technique +15

Degradation of epoxy coatings in humid environments: the critical relative humidity for adhesion loss

D. R. Lefebvre, Ken Takahashi, Anett Müller et al. · Journal of Adhesion Science and Technology · 1991 · 74 citations

Engineering, Wetting, Chemistry +20

Electroplating Copper onto Resistive Barrier Films

Ken Takahashi · Journal of The Electrochemical Society · 2000 · 61 citations

Materials Science, Materials Engineering, Electrical Engineering +15

The critical humidity effect in the adhesion of epoxy to glass: role of hydrogen bonding

D. R. Lefebvre, P. R. Elliker, Ken Takahashi et al. · Journal of Adhesion Science and Technology · 2000 · 40 citations

Engineering, Glass-forming Liquid, Wetting +19

Meniscus shapes on small diameter fibers

Ken Takahashi · Journal of Colloid and Interface Science · 1990 · 40 citations

Engineering, Fiber Structure, Mechanical Engineering +2