Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain

Diffusional Viscosity of a Polycrystalline Solid

Conyers Herring · Journal of Applied Physics · 1950 · 2.5K citations

Engineering, Materials Engineering, Materials Science +17

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

Natural Sciences, Materials Engineering, Materials Science +14

Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions

Sinn-wen Chen, Chih‐Ming Chen, Wen-Chyuarn Liu · Journal of Electronic Materials · 1998 · 203 citations

Natural Sciences, Materials Science, Physics +14