Chi-Pu Lin

Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations

Chi-Pu Lin, Chih‐Ming Chen · Microelectronics Reliability · 2011 · 27 citations

Materials Engineering, Materials Science, Engineering +12

Effect of temperature on microstructural changes of the Sn–9wt.% Zn lead-free solder stripe under current stressing

Chih‐Ming Chen, Yu-Min Hung, Chi-Pu Lin et al. · Materials Chemistry and Physics · 2009 · 26 citations

Materials Science, Engineering, Microstructural Changes +6

Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain

Chi-Pu Lin, Chih‐Ming Chen, Yee‐Wen Yen · Journal of Alloys and Compounds · 2014 · 24 citations

Materials Engineering, Materials Science, Engineering +9

The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish

Chi-Pu Lin, Chih‐Ming Chen · Journal of Alloys and Compounds · 2012 · 21 citations

Materials Science, Materials Engineering, Engineering +8

Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow

Chih-hao Chen, Chi-Pu Lin, Chih‐Ming Chen · Journal of Electronic Materials · 2008 · 17 citations

Materials Science, Materials Engineering, Engineering +9