2007 · 11 citations · 18 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMetallurgySolidificationAlloy SolidificationAlloysCreep BehaviorCreep DeformationMetalsSolidification Of MetalsAlloy Creep BehaviorAlloy Solidification MicrostructureGrain Structure EffectsSoldered JointsSolderingSoldering JointsSolidification ParametersSolidification Shrinkage Effects
The paper describes the strategies of characterizing the creep behaviour of SnAg-and SnAgCu-solders through experiments on bulk specimens and on very tiny solder joints. The characteristic behaviour of these different volumes will be explained and rationalized by metallurgical considerations about the specifics of solidification in very small volumes.
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