Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy

Mechanical behavior of materials

Choice Reviews Online · 1990 · 1.9K citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer · International Materials Reviews · 1995 · 416 citations

Natural Sciences, Materials Engineering, Materials Science +13

Boundary defects, and atomistic aspects of boundary sliding and diffusional creep

Michael F. Ashby · Surface Science · 1972 · 410 citations

Natural Sciences, Mechanical Engineering, Physics +17

Intergranular fracture during power-law creep

Graham Edward, Michael F. Ashby · Acta Metallurgica · 1979 · 238 citations

Engineering, Materials Engineering, Materials Science +12

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16