Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

Time‐cure‐temperature superposition for the prediction of instantaneous viscoelastic properties during cure

Yong‐Sung Eom, L. Boogh, Véronique Michaud et al. · Polymer Engineering and Science · 2000 · 80 citations

Natural Sciences, Materials Engineering, Materials Science +17

Characterization of polymer matrix and low melting point solder for anisotropic conductive film

Yong‐Sung Eom, Jiwon Baek, Jong-Tae Moon et al. · Microelectronic Engineering · 2007 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Jong‐Woong Kim, Won-Chul Moon, Seung‐Boo Jung · Microelectronic Engineering · 2006 · 27 citations

Engineering, Materials Engineering, Materials Science +11

Novel interconnection method using electrically conductive paste with fusible filler

Jong‐Min Kim, Kiyokazu Yasuda, Kozo Fujimoto · Journal of Electronic Materials · 2005 · 26 citations

Engineering, Materials Engineering, Materials Science +16

Isotropic conductive adhesives with fusible filler particles

Jong‐Min Kim, Kiyokazu Yasuda, Kozo Fujimoto · Journal of Electronic Materials · 2004 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +10