Blossom overlay metrology implementation

Christopher P. Ausschnitt, W. H. Chu, D. Kolor, Jaime Morillo, J. Morningstar, William A. Muth, C. Thomison, R. J. Yerdon, Lewis A. Binns, Prasad Dasari,

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2007 · 13 citations · 0 references

Concepts

Abstract

Improved overlay capability and sampling to control advanced lithography has accelerated the need for compact, multilayer/ mask/field/mark overlay metrology. The Blossom approach minimizes the size of the overlay marks associated with each layer while maximizing the density of marks within the overlay metrology tool's field of view (FOV). Here we describe our progress implementing this approach in 45nm manufacturing.