Concepedia
Journal of Materials Science Materials in Electronics · 2012 · 17 citations · 15 references
Materials ScienceEngineeringChemical ReactionsMetallurgical InteractionChemistryElemental MetalChemical Kinetics
15
The current status of lead-free solder alloys
David Suraski, Karl Seelig · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 81 citations
Materials Engineering, Materials Science, Current Status +14
Design and construction of a compact vacuum furnace for scientific research
Chin C. Lee, David T. Wang, Won Seok Choi · Review of Scientific Instruments · 2006 · 68 citations
Compact Vacuum Furnace, Electrical Engineering, Scientific Research +15
Mechanical characteristics of 96.5 Sn/3.5 Ag solder in microbonding
Masahide Harada, Ryohei Satoh · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 68 citations
Engineering, Mechanical Engineering, Structural Materials +17
The kinetics of formation of intermetallics in Ag/In thin film couples
Rita Roy, Shrabanee Sen · Thin Solid Films · 1991 · 62 citations
Materials Science, Engineering, Interfacial Phenomenon +7
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Riko I Made, Chee Lip Gan, Li Ling Yan et al. · Journal of Electronic Materials · 2008 · 54 citations
Materials Engineering, Materials Science, Thermal Insulation +14