Yuan-Yun Wu

Thermal Cycling Reliability Study of Ag–In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes

Yuan-Yun Wu, Dominic Nwoke, Fred Barlow et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 23 citations

Tc Test, Engineering, Fluxless Processes +16

A study of chemical reactions of silver and indium at 180 °C

Yuan-Yun Wu, Wen P. Lin, Chin C. Lee · Journal of Materials Science Materials in Electronics · 2012 · 17 citations

Materials Science, Engineering, Chemical Reactions +4

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee · Journal of Electronic Packaging · 2013 · 16 citations

Materials Engineering, Materials Science, Chemical Engineering +15

Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum

Chin C. Lee, Shou-Jen Hsu, Yuan-Yun Wu · Journal of Electronic Materials · 2013 · 16 citations

Materials Science, Materials Engineering, Engineering +6

Bonding Silicon Chips to Aluminum Substrates Using Ag–In System Without Flux

Yuan-Yun Wu, C. C. Lee · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 12 citations

Engineering, Interconnect (Integrated Circuits), Ag-in Binary System +16