Fred Barlow - Concepedia

Author

Fred Barlow

University of Arkansas at Fayetteville

Also Known As

Barlow, Fred D., F. Barlow, F. D. Barlow, F.D. Barlow, Feng He, Fred Barlow, Fred D. Barlow

102

Publications

1.5K

Citations

H-Index

Concepts

All Affiliations

University of Arkansas at Fayetteville University of Idaho Kyoto University Northrop Grumman (United States)Tuskegee University

About

Fred Barlow is an author at University of Arkansas at Fayetteville specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	23	1.2K
2	Applied Physics	6	6	139
3	Medicine	1	1	68
4	Nursing	1	1	12
5	Public Health	1	1	68

Fred Barlow

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
Power Conversion With SiC Devices at Extremely High Ambient Temperatures Tsuyoshi Funaki, Juan Carlos Balda, Jeremy Junghans, IEEE Transactions on Power Electronics EngineeringPower ConversionEnergy EfficiencyPower ElectronicsSic Jfets	2007	329
Extending the ZVS operating range of dual active bridge high-power DC-DC converters Germán G. Oggier, Roberto Leidhold, Guillermo García, Electrical EngineeringDual Active BridgeEngineeringPower Electronics ConverterElectric Driver	2006	163
Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter Fan Xu, Timothy Junghee Han, Dong Jiang, IEEE Transactions on Power Electronics Integrated Silicon CarbideElectrical EngineeringEngineeringHigh Voltage EngineeringPower Device	2012	139
An overview to integrated power module design for high power electronics packaging Alexander B. Lostetter, Fred Barlow, Aicha Elshabini Microelectronics Reliability Electrical EngineeringChip-scale PackageEngineeringPower IcPower Device	2000	90
Quantitative studies on human spermatogenesis. I. Spermatogonia Edward C. Roosen‐Runge, Fred Barlow American Journal of Anatomy SpermatogenesisInfertilityDevelopmental BiologyFertilityI. Spermatogonia	1953	68
Fabrication of Microvias for Multilayer LTCC Substrates Gang Wang, Erica C. Folk, Fred Barlow, IEEE Transactions on Electronics Packaging Manufacturing Materials ScienceMultilayer Ltcc SubstratesScreen PrintingWafer Scale ProcessingEngineering	2006	59
18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules Hui Zhang, Leon M. Tolbert, Jung Hee Han, Electrical EngineeringEngineeringPower DeviceEnergy EfficiencyHigh Temperature Packaging	2010	42
Fabrication of Precise Fluidic Structures in LTCC Fred Barlow, Jared Wood, Aicha Elshabini, International Journal of Applied Ceramic Technology	2008	35
Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging Raymond L. Dietz, J.P. Yaskoff, G. H. Schiroky, IEEE Transactions on Components and Packaging Technologies EngineeringMechanical EngineeringTemperature DependenceInterfacial Thermal ResistanceThermal Insulation	2000	34
Low cost flex substrates for miniaturized electronic assemblies Fred Barlow, Alexander B. Lostetter, Aicha Elshabini Microelectronics Reliability Materials ScienceElectrical EngineeringLow Cost FlexEngineeringWafer Scale Processing	2002	32

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