Concepedia

Aicha Elshabini

AE

Statistics

Publications

12

Citations

380

H-Index

11

Active since

2000

Affiliations

University of Arkansas at Fayetteville(Current)

University of Idaho

Northrop Grumman (United States)

Aicha Elshabini is an author at University of Arkansas at Fayetteville specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingMicrofabricationElectrical EngineeringMaterial ScienceMechanical EngineeringHeat TransferApplied PhysicsThermal Engineering

Publications per year

2000–2015

12

Publications

12

An overview to integrated power module design for high power electronics packaging

Alexander B. Lostetter, Fred Barlow, Aicha Elshabini · Microelectronics Reliability · 2000 · 90 citations

Electrical Engineering, Chip-scale Package, Engineering +6

Fabrication of Microvias for Multilayer LTCC Substrates

Gang Wang, Erica C. Folk, Fred Barlow et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2006 · 59 citations

Materials Science, Multilayer Ltcc Substrates, Screen Printing +15

Fabrication of Precise Fluidic Structures in LTCC

Fred Barlow, Jared Wood, Aicha Elshabini et al. · International Journal of Applied Ceramic Technology · 2008 · 35 citations

Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging

Raymond L. Dietz, J.P. Yaskoff, G. H. Schiroky et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 34 citations

Engineering, Mechanical Engineering, Temperature Dependence +16

Low cost flex substrates for miniaturized electronic assemblies

Fred Barlow, Alexander B. Lostetter, Aicha Elshabini · Microelectronics Reliability · 2002 · 32 citations

Materials Science, Electrical Engineering, Low Cost Flex +8

Rows per page

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