Raymond L. Dietz is an author at NeuroMetrix (United States) specializing in mechanical engineering, materials science, and electronic packaging.
Top concepts
EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringHeat TransferThermodynamicsAdhesive MaterialsThermal EngineeringApplied PhysicsPolymer Science
Publications per year
1996–2003
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Raymond L. Dietz, J.P. Yaskoff, G. H. Schiroky et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 34 citations
Engineering, Mechanical Engineering, Temperature Dependence +16
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