Failure analysis techniques for a 3D world

Near-Threshold Computing: Reclaiming Moore's Law Through Energy Efficient Integrated Circuits

Ronald Dreslinski, Michael Wieckowski, David Blaauw et al. · Proceedings of the IEEE · 2010 · 824 citations

Engineering, Vlsi Design, Computer Architecture +16

Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography

Christian Schmidt, Frank Altmann, Rudolf Schlangen et al. · 2010 · 38 citations

Engineering, Measurement, Education +21

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

Frank Altmann, Jens Beyersdorfer, Jan Schischka et al. · Proceedings - International Symposium for Testing and Failure Analysis · 2012 · 14 citations

Materials Science, Advanced Packaging, Engineering +14

Wafer stacking: key technology for 3D integration

C. Lagahe-Blanchard, B. Aspar · 2009 · 13 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +18