An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing

Pad conditioning in chemical mechanical polishing

Bill Hooper, Greg Byrne, S Galligan · Journal of Materials Processing Technology · 2002 · 125 citations

Engineering, Materials Engineering, Materials Science +11

Effects of kinematic variables on nonuniformity in chemical mechanical planarization

H. Hocheng, Han-Hao Tsai, M. S. Tsai · International Journal of Machine Tools and Manufacture · 2000 · 89 citations

Engineering, Chemical Engineering, Chemistry +8

Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization

Hyoungjae Kim, Haedo Jeong · Journal of Electronic Materials · 2004 · 61 citations

Engineering, Materials Engineering, Materials Science +15

Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing

Hoyoun Kim, Hoyoun Kim, Hyoungjae Kim et al. · Journal of Materials Processing Technology · 2003 · 53 citations

Engineering, Materials Engineering, Materials Science +14

Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity

Peter G. van der Velden · Microelectronic Engineering · 2000 · 49 citations

Engineering, Materials Engineering, Materials Science +16