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Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration
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2010
Year
EngineeringMechanical EngineeringNon‐deformed BeolComputer-aided DesignVolume ParameterizationComputational MechanicsAxial Deformation ProblemInterconnect (Integrated Circuits)Isogeometric AnalysisAdvanced Packaging (Semiconductors)Numerical SimulationOut‐of‐plane ExpansionBoundary Element MethodMaterials ScienceGeometric Modeling3D Ic ArchitectureChip AttachmentSolid MechanicsUnstructured Mesh GenerationMicroelectronics3D PrintingAdvanced PackagingThree-dimensional Heterogeneous IntegrationNatural SciencesApplied PhysicsCopper Through‐silicon‐viaSolid ModelingMechanics Of MaterialsMultiscale Modeling
The out‐of‐plane expansion of Copper Through‐Silicon‐Via (Cu‐TSV) is a concern in 3D stacking of chips, since it pushes against the BEOL, thus posing a possible reliability risk. In this study we demonstrate a solution for the Cu‐TSV out‐of‐plane expansion problem resulting in a non‐deformed BEOL. This is achieved through gaining a good understanding of the thermo‐mechanical behavior of Cu by experiments and adopting this learning in our process flow.