Deformation analysis of Au wire bonding

Crack mechanism in wire bonding joints

S. Ramminger, P. Türkes, G. Wachutka · Microelectronics Reliability · 1998 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13

Wirebonding at higher ultrasonic frequencies: reliability and process implications

Harry K. Charles, K. J. Mach, S. J. Lehtonen et al. · Microelectronics Reliability · 2003 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +7

Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds

Daniel T. Rooney, DeePak Nager, David Geiger et al. · Microelectronics Reliability · 2005 · 34 citations

Engineering, Materials Engineering, Materials Science +17

A concept to relate wire bonding parameters to bondability and ball bond reliability

Z.N. Liang, F.G. Kuper, M.S. Chen · Microelectronics Reliability · 1998 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +7

An experimental model of the microelectronic ultrasonic wire bonding mechanism

Microelectronics Reliability · 1973 · 23 citations

Engineering, Electrical Engineering, Materials Science +10