Evaluation of (hfac)Cu(MHY) for Cu CVD

Copper metallization for ULSL and beyond

S. P. Murarka, Steven W. Hymes · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 1995 · 260 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Mechanistic studies of copper thin-film growth from CuI and CuII .beta.-diketonates

Gregory S. Girolami, Patrick M. Jeffries, Lawrence H. Dubois · Journal of the American Chemical Society · 1993 · 129 citations

Natural Sciences, Chemistry, Materials Science +13

Chemical vapor deposition of copper from 1,5-cyclooctadiene copper(I) hexafluoroacetylacetonate

Scott Reynolds, Christopher J. Smart, E. Baran et al. · Applied Physics Letters · 1991 · 112 citations

Natural Sciences, Chemistry, Materials Science +14

Advanced copper interconnections for silicon CMOS technologies

J. Torrès · Applied Surface Science · 1995 · 102 citations

Engineering, Computer Engineering, Electrical Engineering +14

Chemical Vapor Deposition of Copper for IC Metallization: Precursor Chemistry and Molecular Structure

P. Doppelt, Thomas H. Baum · MRS Bulletin · 1994 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +17