Concepedia

Thermomechanical response and stress analysis of copper interconnects

E. S. Ege, Yu‐Lin Shen

Journal of Electronic Materials · 2003 · 34 citations · 39 references

DOI

Concepts

References

39

The Elastic Constants of a Solid containing Spherical Holes

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Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers

Haibo Huang, F. Spaepen · Acta Materialia · 2000 · 609 citations

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Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

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Electromigration path in Cu thin-film lines

C.‐K. Hu, R. Rosenberg, K. Y. Lee · Applied Physics Letters · 1999 · 329 citations

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Thermal strain and stress in copper thin films

Richard P. Vinci, E. M. Zielinski, J. C. Bravman · Thin Solid Films · 1995 · 264 citations

, , +17