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Over 2 A Operation at 250 °C of GaN Metal–Oxide–Semiconductor Field Effect Transistors on Sapphire Substrates
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Citations
5
References
2008
Year
Wide-bandgap SemiconductorElectrical EngineeringEngineeringSapphire SubstratesApplied PhysicsPower Semiconductor DeviceGan MosfetsGan Power DeviceMicroelectronicsOperation Gan MosfetsGate Width
We investigated normally off operation GaN metal–oxide–semiconductor field effect transistors (MOSFETs). The drain current of GaN MOSFETs with a gate width of 1 mm increased from 0.004 to 0.1 A by which the channel length decreased from 100 to 2 µm. However, the on-resistance was increased by shortening a channel length. In addition, the drain current of GaN MOSFETs with the channel length of 4 µm was increased from 0.08 A to more than 2.2 A, by which the channel width was increased from 1 to 16 mm. As a result, we achieved normally off operation GaN MOSFETs with the highest operation temperature of 250 °C. The drain current was 2.2 A at Vg=+14 V. The threshold voltage (Vth) was +3 V.
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