Silicon-On-Diamond layer integration by wafer bonding technology

Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding^*1

M. Bruel, Bernard ASPAR Andre-Jacques AUBERTON-HERVE · Japanese Journal of Applied Physics · 1997 · 242 citations

Engineering, Materials Engineering, Materials Science +17

Diamond as a unique high-tech electronic material: difficulties and prospects

R. Kalish · Journal of Physics D Applied Physics · 2007 · 109 citations

Engineering, Materials Science, Physics +16

Surface smoothing of diamond membranes by reactive ion etching process

C. Vivensang, Laurence Ferlazzo-Manin, M. F. Ravet et al. · Diamond and Related Materials · 1996 · 56 citations

Engineering, Materials Engineering, Materials Science +15

Evaluation research of polishing methods for large area diamond films produced by chemical vapor deposition

Han-Hao Tsai, Chia‐Jen Ting, C. P. Chou · Diamond and Related Materials · 2006 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +11

Microscopic measurements of the local heat conduction in polycrystalline diamond films

Karsten Plamann, Danièle Fournier, Benoı̂t C. Forget et al. · Diamond and Related Materials · 1996 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +14