Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System

Abstract

A novel monolithic integration of RF MEMS switch and CMOS IC on organic substrate was demonstrated. RF MEMS switch was firstly fabricated on CMOS IC wafer, and the stacked structure was subsequently transferred onto an organic substrate (i.e., FR-4). The RF-MEMS switch illustrates significantly improved performance, while integrated together, the CMOS show preserved functionality. This technology demonstrates the feasibility and potential applicability of building high performance, compact RF system for wireless communication