Concepedia

Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits

Nobuyuki SHISHIDO, Shinsuke Watanabe, Hisashi Sato, Kozo KOIWA, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, T. Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

Surface and Coatings Technology · 2012 · 13 citations · 16 references

DOI

Concepts

References

16

A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

Panos G. Charalambides, J. A. Lund, A.G. Evans et al. · Journal of Applied Mechanics · 1989 · 910 citations

, , +17

Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination

D. B. Marshall, A.G. Evans · Journal of Applied Physics · 1984 · 457 citations

, , +17

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

, , +13

Mechanical property characterization of thin films using spherical tipped indenters

Michael V. Swain, Jaroslav Menčík · Thin Solid Films · 1994 · 167 citations

, , +8

Microwedge indentation of the thin film fine line—I. Mechanics

Maarten P. Boer, W. W. Gerberich · Acta Materialia · 1996 · 104 citations

, , +9