Journal of The Electrochemical Society · 2011 · 22 citations · 16 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor MaterialsDielectric CeramicsDielectric PropertiesDielectricsHigh-frequency Semiconductor DevicesMos CapacitorsThin Film Electrical PropertiesCapacitanceCapacitance-voltage CharacteristicsCurrentsDielectric StrengthLeakageMulti-layer CapacitorsOxide Dielectrics
MIM capacitors for RF applications with sputtered Er2O3 on ALD SiO2 stacked dielectrics with excellent capacitance performance were demonstrated for the first time. An MIM capacitor with 8.8 nm Er2O3 on 3 nm SiO2 stacked dielectrics displayed a high capacitance density of 7 fF/μm2, a low quadratic VCC of less than 100 ppm/V2, a low leakage current at 3.3 V bias of 1 × 10−8 A/cm2, and a high dielectric field strength of 8.7 MV/cm. Having leakage currents of 1 × 10−7 and 4 × 10−8 A/cm2 at 3.3 and 2 V, respectively, the MIM capacitor with 7 nm Er2O3 on 3 nm SiO2 stacked dielectrics demonstrated a capacitance density of 7.4 fF/μm2 and quadratic VCCs of −91 and −255 ppm/V2 at 10 and 100 kHz, respectively. The low quadratic VCC α was obtained by compensating the positive α of Er2O3 with the negative α of SiO2, while the low leakage current and high oxide field strength demonstrated were due to the high quality SiO2 deposited by the ALD method.
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A capacitorless double-gate DRAM cell
Chenming Hu, Tsu‐Jae King, Chenming Hu · IEEE Electron Device Letters · 2002 · 130 citations
Engineering, Computer Engineering, Electrical Engineering +14
Rare-Earth Tungstates and 1:1 Oxytungstates
Hans J. Borchardt · The Journal of Chemical Physics · 1963 · 107 citations