Electrochemical behavior of a new solder material (Sn–In–Ag)

In search of new lead-free electronic solders

E. P. Wood, Kay Nimmo · Journal of Electronic Materials · 1994 · 226 citations

Natural Sciences, Materials Engineering, Materials Science +7

Issues in the replacement of lead-bearing solders

Paul T. Vianco, D. R. Frear · JOM · 1993 · 190 citations

Engineering, Manufacturing Engineering, Metallurgy +4

Progress in the design of new lead-free solder alloys

M. McCormack, Sungho Jin · JOM · 1993 · 116 citations

Natural Sciences, Materials Engineering, Materials Science +9

Evaluation of Lead- Free Solder Joints in Electronic Assemblies

I. Artaki, A.M. Jackson, Paul T. Vianco · Journal of Electronic Materials · 1994 · 90 citations

Engineering, Materials Engineering, Materials Science +10

Thermodynamics of the Sn-In-Ag solder system

Tia‐Marje Korhonen, J.K. Kivilahti · Journal of Electronic Materials · 1998 · 83 citations

Natural Sciences, Materials Engineering, Materials Science +12