Concepedia

A.M. Jackson

AJ

6

Publications

219

Citations

6

H-Index

1989

Active since

Affiliations

AT&T (United States)(Current)

Sandia National Laboratories

Nokia (United States)

A.M. Jackson is an author at AT&T (United States) specializing in materials science, engineering, and electronic packaging.

ORCID

Top concepts

Publications per year

1989–2002

6

Publications

6

Evaluation of Lead- Free Solder Joints in Electronic Assemblies

I. Artaki, A.M. Jackson, Paul T. Vianco · Journal of Electronic Materials · 1994 · 88 citations

, , +4

Correlation of silver migration with temperature-humidity-bias (THB) failures in multilayer ceramic capacitors

H. C. Ling, A.M. Jackson · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 61 citations

, , +14

Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

Paul T. Vianco, Jerome A. Rejent, I. Artaki et al. · 2002 · 24 citations

, , +16

Effect of PbO evaporation on the composition and dielectric properties of PbO-MgO-Nb<sub>2</sub>O<sub>5</sub> based dielectrics

H. C. Ling, A.M. Jackson, M. F. Yan et al. · Journal of materials research/Pratt's guide to venture capital sources · 1990 · 20 citations

, , +4

Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

I. Artaki, A.M. Jackson, Paul T. Vianco · Soldering and Surface Mount Technology · 1995 · 16 citations

, , +10

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