Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C

Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test

Munehiro Date, T. Shoji, M. Fujiyoshi et al. · Scripta Materialia · 2004 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +16

Phase equilibria of the Sn–Zn–Cu ternary system

Chin-yi Chou, Sinn-wen Chen · Acta Materialia · 2006 · 150 citations

Natural Sciences, Chemistry, Inorganic Chemistry +11

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih et al. · Journal of Electronic Materials · 2007 · 138 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermodynamic modeling of the nickel-lead-tin system

Gautam Ghosh · Metallurgical and Materials Transactions A · 1999 · 107 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Sung K. Kang, Donovan N. Leonard, Da‐Yuan Shih et al. · Journal of Electronic Materials · 2006 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +12