Electronics Letters · 1981 · 41 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSurface ScienceDefects In Electronic MaterialsDevice CharacterizationDevice ReliabilitySemiconductor Device MaterialsSemiconductor InterfacesSemiconductor ReliabilityAging CharacterizationContact DegradationContact ReliabilityDevice DegradationInterface ReliabilityOhmic ContactsReliability DegradationThermal Stability
The reliability of AuGe/Pt and AuGe/Ni ohmic contacts with and without overlay metal (Ti/Au, Ti/Pt/Au or TiW/Au) has been studied. AuGe/Ni contacts have proved superior and more reliable than AuGe/Pt contacts with or without overlay. AuGe/Pt contacts are stable without overlay but degrade rapidly with overlay. AuGe/Ni contacts exhibit thermal stability after 1000 hours' aging at 250°C.