Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Lead (Pb)-free solders for electronic packaging

Sung K. Kang, Amit Sarkhel · Journal of Electronic Materials · 1994 · 333 citations

Agriculture, Materials Engineering, Materials Science +8

Characterization of eutectic Sn-Bi solder joints

Z. Mei, J. W. Morris · Journal of Electronic Materials · 1992 · 315 citations

Natural Sciences, Materials Engineering, Materials Science +8

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations

Natural Sciences, Materials Engineering, Materials Science +16

Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters · 1995 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +17