IEEE Transactions on Nuclear Science · 1979 · 30 citations · 11 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsAbsorbed DoseDevice ModelingHigh-dose Radiation EffectsHigh-frequency Semiconductor DevicesSemiconductor ReliabilityActivation EnergyActivation Energy DistributionPulsed Radiation ResponseRadiation Damage EffectsRadiation EffectsRadiation-tolerant Semiconductor DevicesTransient Device ModelingTrapping Effects
A long-term transient response mechanism has been discovered in certain GaAs FETs and FET logic circuits exposed to low level (~ 100 rad) ionizing radiation pulses. Recovery times ranging from 1 to 70 seconds have been measured following room temperature exposures. Charge trapping within the semiinsulating GaAs substrate appears to be a mechanism responsible for the observed behavior. Experiments conducted between 0° and 200°C have identified an acceptor level characterized by an activation energy in the 0.7 to 0.8 eV range.
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Electrical traps in GaAs microwave f.e.t.s
M.G. Adlerstein · Electronics Letters · 1976 · 39 citations
B.G. Bosch · Proceedings of the IEEE · 1979 · 35 citations