Obtaining of high surface roughness copper deposits by electroless plating technique

References

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	Year	Citations
Interaction of pyridine‐ and 4‐hydroxypyridine‐2,6‐dicarboxylic acids with heavy metal ions in aqueous solutions Eugenijus Norkus, Irena Stalnionienė, Debbie C. Crans Heteroatom Chemistry Inorganic ChemistryChemical EngineeringHeavy Metal IonsWeak AcidEngineering	2003	57
On the Mechanism of Electroless Copper Deposition Harm Wiese, Konrad G. Weil Berichte der Bunsengesellschaft für physikalische Chemie Materials ScienceElectrometallurgyElectrical EngineeringChemical EngineeringEngineering	1987	53
Ligand Effects in Electroless Copper Deposition Milan Paunović Journal of The Electrochemical Society Materials ScienceInorganic ChemistryChemical EngineeringInduction PeriodEngineering	1977	47
Effect of the Cu electrode formation conditions and surface nano-scale roughness on formaldehyde anodic oxidation A. Vaškelis, Eugenijus Norkus, Irena Stalnionien≐, Electrochimica Acta Materials ScienceEngineeringSurface ElectrochemistrySurface ScienceChemistry	2004	36
Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands Eugenijus Norkus, A. Vaškelis, Janė Jačiauskienė, Journal of Applied Electrochemistry Chemical EngineeringEngineeringElectroless CopperGreen ChemistryGreen Synthesis	2005	27
Diffusion coefficients of Cu(II) complexes with ligands used in alkaline electroless copper plating solutions Eugenijus Norkus Journal of Applied Electrochemistry	2000	27
Changes of the Cu electrode real surface area during the process of electroless copper plating Eugenijus Norkus, Algirdas Va kelis, Irena Stalnionienė Journal of Solid State Electrochemistry Electroless Copper PlatingElectrical EngineeringEngineeringSurface ScienceElectrode Reaction Mechanism	2000	21
The kinetic isotope effect in electroless copper plating. An EQCM study Z. Jusys, Giedrius Stalnionis, Eimutis Juzeliūnas, Electrochimica Acta Materials ScienceMaterials EngineeringChemical EngineeringElectroless Copper PlatingEngineering	1998	20
EQCM study of the effect of ligands on the rate of CuII reduction by formaldehyde Z. Jusys, Rasa Pauliukaitė, A. Vaškelis Physical Chemistry Chemical Physics Materials ScienceInorganic ChemistryChemical EngineeringEngineeringSurface Electrochemistry	1999	17

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