Obtaining of high surface roughness copper deposits by electroless plating technique

Interaction of pyridine‐ and 4‐hydroxypyridine‐2,6‐dicarboxylic acids with heavy metal ions in aqueous solutions

Eugenijus Norkus, Irena Stalnionienė, Debbie C. Crans · Heteroatom Chemistry · 2003 · 57 citations

Inorganic Chemistry, Chemical Engineering, Heavy Metal Ions +13

On the Mechanism of Electroless Copper Deposition

Harm Wiese, Konrad G. Weil · Berichte der Bunsengesellschaft für physikalische Chemie · 1987 · 53 citations

Materials Science, Electrometallurgy, Electrical Engineering +14

Ligand Effects in Electroless Copper Deposition

Milan Paunović · Journal of The Electrochemical Society · 1977 · 47 citations

Materials Science, Inorganic Chemistry, Chemical Engineering +12

Effect of the Cu electrode formation conditions and surface nano-scale roughness on formaldehyde anodic oxidation

A. Vaškelis, Eugenijus Norkus, Irena Stalnionien≐ et al. · Electrochimica Acta · 2004 · 36 citations

Materials Science, Engineering, Surface Electrochemistry +7

Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands

Eugenijus Norkus, A. Vaškelis, Janė Jačiauskienė et al. · Journal of Applied Electrochemistry · 2005 · 27 citations

Chemical Engineering, Engineering, Electroless Copper +5