Janė Jačiauskienė

Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

G. Rozovskis, J. Vinkevičius, Janė Jačiauskienė · Journal of Adhesion Science and Technology · 1996 · 77 citations

Engineering, Copper Coatings, Plasma Processing +17

Obtaining of high surface roughness copper deposits by electroless plating technique

Eugenijus Norkus, A. Vaškelis, Janė Jačiauskienė et al. · Electrochimica Acta · 2005 · 36 citations

Materials Science, Electrometallurgy, Engineering +3

Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions

A. Vaškelis, Janė Jačiauskienė, Irena Stalnionienė et al. · Journal of Electroanalytical Chemistry · 2006 · 32 citations

Materials Science, Alkaline Formaldehyde-containing Solutions, Chemical Engineering +8

Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands

Eugenijus Norkus, A. Vaškelis, Janė Jačiauskienė et al. · Journal of Applied Electrochemistry · 2005 · 27 citations

Chemical Engineering, Engineering, Electroless Copper +5

Evidence of two-step deprotonation of d-mannitol in aqueous solution

Ernestas Gaidamauskas, Eugenijus Norkus, Jūrate Vaičiūnienė et al. · Carbohydrate Research · 2005 · 17 citations

Engineering, Solution (Chemistry), Organic Chemistry +7