IEEE Transactions on Electron Devices · 2012 · 199 citations · 33 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesCurrent-voltage CharacteristicsDevice ModelingDevice ReliabilityMemory DevicesMemristive MaterialsSemiconductor ReliabilityConductive Filament FormationIon MigrationLogic DevicesMemory MaterialsMemristive MemoryResistive Random-access MemoryResistive SwitchingTransition Metal Oxides
Resistive-switching random access memory (RRAM) based on the formation and the dissolution of a conductive filament (CF) through insulating materials, e.g., transition metal oxides, may find applications as novel memory and logic devices. Understanding the resistive-switching mechanism is essential for predicting and controlling the scaling and reliability performances of the RRAM. This paper addresses the set/reset characteristics of RRAM devices based on <formula formulatype="inline" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex Notation="TeX">$\hbox{HfO}_{x}$</tex></formula> . The set process is analyzed as a function of the initial high-resistance state and of the current compliance. The reset process is studied as a function of the initial low-resistance state. Finally, the intermediate set states, obtained by set at variable compliance current, and reset states, obtained by reset at variable stopping voltage, are characterized with respect to their reset voltage, allowing for a microscopic interpretation of intermediate states in terms of different filament morphologies.
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High switching endurance in TaOx memristive devices
J. Joshua Yang, M.-X. Zhang, John Paul Strachan et al. · Applied Physics Letters · 2010 · 634 citations · Full text