IEEE Transactions on Electron Devices · 2015 · 30 citations · 17 references
EngineeringComputer EngineeringElectrical EngineeringLow-power DesignMicroelectronicsSemiconductor DevicesCmos Circuit DesignDevice ModelingLeakage Power ReductionMetal-oxide-semiconductor Field-effect TransistorsPower-aware DesignShort-channel EffectsGate LeakageGate Oxide LeakageLeakage Current ModelingLeakage Current ReductionLow-power Cmos DesignQuantum Confinement EffectsSource-drain LeakageUltra-low-power Cmos
III–V n-channel MOSFETs based on In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><i>x</i></sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1−<i>x</i></sub> As are evaluated for low-power (LP) technology at a sub-10-nm technology node. Aggressive design rules are followed, while industry-relevant FinFET architecture is selected. We show, for the first time, quantum confinement-related leakage and performance tradeoff done self-consistently in performance evaluation using an in-house developed semiclassical tool. In this paper, we focus on In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.53</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.47</sub> As as the channel material, as it has been investigated heavily in the literature. Furthermore, it has a bulk bandgap <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$E_{G}$ </tex-math></inline-formula> similar to that of Ge, another highly studied complementary p-FET channel material. Higher In-content results in lower <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$E_{G}$ </tex-math></inline-formula> and hence larger band-to-band tunneling (BTBT) current, resulting in more stringent design requirements for LP applications. A comparison is done with the state-of-the-art tensile-Si (t-Si) technology, with roughly 2-GPa stress, under similar constraints ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$L_{G}$ </tex-math></inline-formula> , design rules). Thus, we show that while for 0.75 V operation, In <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.53</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.47</sub> As performance is limited by the BTBT and fails to outperform t-Si, it starts to perform better than t-Si below 0.7 V. <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{{\rm {DD}}}$ </tex-math></inline-formula> scaling further results in an increased performance gap between the two material systems.
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