Exploiting the third dimension in power electronics packaging

Abstract

A common feature of current power electronics packaging is that technologies and concepts of low power electronics are adapted and consequently the circuit remains essentially two dimensional. Exploitation of the third dimension, namely the height creates volume which is essential for the energy storage and conversion functions and also makes compact packaging possible. However, as the height and therefore the volume increases, thermal considerations become increasingly important. A concept involving multiple layers of electromagnetic materials and switching function layers is proposed. A module is encapsulated in a ferrite and copper casing ensuring low EMI and EMS. The module has both electrical and thermal ports to interface with its environment. The concept is illustrated using two prototype DC to DC power converters.