IEEE Microwave and Wireless Components Letters · 2015 · 27 citations · 15 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsMicrowave EngineeringHigh-frequency Semiconductor DevicesIntegrated Circuit DesignMicrowave AmplifiersMicrowave Integrated CircuitsMicrowave Semiconductor DevicesRadio-frequency Integrated CircuitsBuffer AmplifiersMillimeter-wave Integrated CircuitsMillimeter-wave TransistorsMonolithic Microwave Integrated Circuit AmplifiersMonolithic Microwave Integrated Circuit DesignMonolithic Microwave Integrated Circuits
In this letter, we demonstrate the first 400 GHz multiplier chain with integrated buffer amplifiers through the chain. The x9 multiplier chain uses 25 nm InP HEMT MMIC technology. The chain consists of three packaged MMICs in split-block waveguide packages with each multiplier incorporating an integrated output buffer. We report a peak output of 6.9 mW and greater than 4 mW over a 10% bandwidth.
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