Concepedia

Direct silver bonding – an alternative for substrates in power semiconductor packaging

C. Chr. Schu ̈ler, A. Stuck, N. Beck, Hasan Erinc Keser, U. Ta ̈ck

Journal of Materials Science Materials in Electronics · 2000 · 35 citations · 11 references

Concepts

EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMetallic MaterialsSemiconductor MaterialsChip PackagingMetal-semiconductor ContactsSemiconductor Device MaterialsSemiconductor NanomaterialsSemiconductor SurfacesWafer BondingAdvanced PackagingDevice PackagingPackaging For Power DevicesPackaging TechniquesPower Electronics Packaging

References

11

Millipore pays US$3.5 M in patent dispute

Membrane Technology · 1998 · 513 citations

Law, Commercial Law, Intellectual Property Law +12

The thermomechanical integrity of thin films and multilayers

A.G. Evans, J.W. Hutchinson · Acta Metallurgica et Materialia · 1995 · 440 citations

Natural Sciences, Materials Engineering, Materials Science +14

Study of copper-alumina bonding

C. Béraud, Michel Courbière, C. Esnouf et al. · Journal of Materials Science · 1989 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +12

The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic Method

James Burgess, C. A. Neugebauer, George Flanagan · Journal of The Electrochemical Society · 1975 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +16

Role of Oxygen in Bonding Copper to Alumina

Yuichi Yoshino · Journal of the American Ceramic Society · 1989 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +16