The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic Method

Abstract

The direct bonding of metals to ceramics is possible utilizing a gas‐metal eutectic. The mechanism of direct bonding of copper foil to ceramics in a slightly oxidizing atmosphere is presented. It involves the formation of eutectic melt between copper and oxygen at a temperature slightly below the melting point of copper, which serves to bring the foil into intimate contact with the substrate. A brief review of other metal‐ceramic bonding techniques is given for comparison. Metals to which this technique is applicable include Cu, Fe, Ni, Co, Ag, Cr, Mo, and Al.