Concepedia

Wafer Adhesion

Wafer Adhesion is a material interface phenomenon in semiconductor packaging that denotes the bonding strength and reliability between a semiconductor wafer and its adjacent substrate or encapsulation layer within pouching systems, distinguished by its critical role in maintaining structural integrity and thermal performance under mechanical and environmental stresses.

152

Publications

5.8K

Citations

614

Authors

166

Institutions

Publications per year

2017–2026

25

Parents

Publications

152

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 463 citations

, , +17

Direct measurement of graphene adhesion on silicon surface by intercalation of nanoparticles

Zong Zong, Chia‐Ling Chen, Mehmet R. Dokmeci et al. · Journal of Applied Physics · 2010 · 204 citations

, , +17

Semiconductor wafer bonding via liquid capillarity

Z. L. Liau · Applied Physics Letters · 2000 · 200 citations

, , +17

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Dunji Yu, Xu Chen, Gang Chen et al. · Materials & Design (1980-2015) · 2009 · 186 citations

, , +10

Mechanism of Metallic Particle Growth and Metal‐Induced Pitting on Si Wafer Surface in Wet Chemical Processing

Hitoshi Morinaga, Makoto Suyama, Tadahiro Ohmi · Journal of The Electrochemical Society · 1994 · 184 citations

, , +17

1–5 of 152

Authors

614

  1. GS
    Göran Stemme

    KTH Royal Institute of Technology, Sweden

    10 publications · 889 citations

    10

    h-index

  2. FN
    Frank Niklaus

    KTH Royal Institute of Technology, Sweden

    9 publications · 799 citations

    9

    h-index

  3. TS
    Tadatomo Suga

    The University of Tokyo, Japan

    7 publications · 288 citations

    7

    h-index

  4. UG
    U. Gösele

    Max Planck Institute of Microstructure Physics, Germany

    7 publications · 274 citations

    7

    h-index

  5. PE
    Peter Enoksson

    Chalmers University of Technology, Sweden

    4 publications · 269 citations

    4

    h-index

1–5 of 614

Institutions

166

  1. KTH Royal Institute of Technology

    Stockholm, Sweden

    10 h-index

    46 publications

    2.5K citations

  2. The University of Tokyo

    Tokyo, Japan

    7 h-index

    20 publications

    806 citations

  3. Duke University

    Durham, United States

    7 h-index

    21 publications

    1.1K citations

  4. Max Planck Institute of Microstructure Physics

    Halle, Germany

    6 h-index

    18 publications

    951 citations

  5. IMEC

    Leuven, Belgium

    6 h-index

    37 publications

    626 citations

  6. Chinese Academy of Sciences

    Beijing, China

    5 h-index

    24 publications

    405 citations

  7. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    5 h-index

    19 publications

    494 citations

  8. Japan Science and Technology Agency

    Tokyo, Japan

    4 h-index

    4 publications

    118 citations

1–8 of 166

Venues

  1. Sensors and Actuators A Physical

    13 publications · 504 citations

    12

    h-index

  2. Japanese Journal of Applied Physics

    JJAP · 7 publications · 262 citations

    7

    h-index

  3. Microelectronics Reliability

    6 publications · 117 citations

    6

    h-index

  4. Journal of The Electrochemical Society

    JES · 6 publications · 351 citations

    6

    h-index

  5. 5

    h-index

1–5