Hitoshi Morinaga

Mechanism of Metallic Particle Growth and Metal‐Induced Pitting on Si Wafer Surface in Wet Chemical Processing

Hitoshi Morinaga, Makoto Suyama, Tadahiro Ohmi · Journal of The Electrochemical Society · 1994 · 182 citations

Engineering, Wet Chemical Processing, Surface Nanotechnology +20

Behavior of Ultrafine Metallic Particles on Silicon Wafer Surface

Hitoshi Morinaga, T. Futatsuki, Tadahiro Ohmi et al. · Journal of The Electrochemical Society · 1995 · 67 citations

Engineering, Surface Nanotechnology, Vacuum Device +21

Advanced Alkali Cleaning Solution for Simplification of Semiconductor Cleaning Process

Hitoshi Morinaga, Masumi Aoki, Toshiaki Maeda et al. · MRS Proceedings · 1997 · 27 citations

Chemical Engineering, Electrical Engineering, Engineering +6

Origin and Innovations of CMP Slurry

Hitoshi Morinaga · ECS Journal of Solid State Science and Technology · 2024 · 20 citations · Full text

Analysis of Chemical and Mechanical Factors in CMP Processes for Improving Material Removal Rate

Kazusei Tamai, Hitoshi Morinaga, Toshiro Doi et al. · Journal of The Electrochemical Society · 2011 · 12 citations

Engineering, Mechanical Engineering, Material Removal Rate +23