Thin-film Encapsulation

Thin-Film Encapsulation is a wafer-level packaging technique in BioMEMS that involves the deposition of thin, multilayered films to hermetically seal and protect microdevices at the substrate surface.

219

Publications

8.7K

Citations

1K

Authors

276

Institutions

Publications per year

2017–2026

66

Authors

1K

  1. KC
    Kyung Cheol Choi

    Korea Advanced Institute of Science and Technology, South Korea

    8 publications · 661 citations

    8

    h-index

  2. YD
    Yu Duan

    Jilin University, China

    7 publications · 583 citations

    8

    h-index

  3. TW
    Thomas W. Kenny

    Stanford University, United States

    7 publications · 261 citations

    7

    h-index

  4. SG
    Sung Gap Im

    Korea Advanced Institute of Science and Technology, South Korea

    7 publications · 194 citations

    7

    h-index

  5. AW
    Ann Witvrouw

    IMEC, Belgium

    5 publications · 117 citations

    5

    h-index

1–5 of 1K

Venues

  1. Organic Electronics

    15 publications · 741 citations

    14

    h-index

  2. ACS Applied Materials & Interfaces

    10 publications · 607 citations

    10

    h-index

  3. Thin Solid Films

    10 publications · 236 citations

    10

    h-index

  4. Journal of Microelectromechanical Systems

    9 publications · 328 citations

    9

    h-index

  5. SID Symposium Digest of Technical Papers

    9 publications · 261 citations

    9

    h-index

1–5