Concepedia

Surface Micromachining Release

Surface Micromachining Release is a microfabrication process, belonging to the class of sacrificial layer techniques, that selectively removes a transient structural layer to enable the formation of suspended microscale mechanical elements in surface micromachined devices.

24

Publications

674

Citations

77

Authors

28

Institutions

Publications per year

2017–2026

0

Parents

Publications

24

Dry release for surface micromachining with HF vapor-phase etching

Yong‐Ill Lee, K.-H. Park, Jae Wook Lee et al. · Journal of Microelectromechanical Systems · 1997 · 116 citations

, , +17

<title>Critical point drying and cleaning for MEMS technology</title>

Ijaz H. Jafri, H.H. Busta, Steven T. Walsh · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1999 · 59 citations

, , +17

Photoresist-Assisted Release of Movable Microstructures

D. Kobayashi, Chang‐Jin Kim, Hiroyuki Fujita · Japanese Journal of Applied Physics · 1993 · 58 citations

, , +17

A new pick up and release method by heating for micromanipulation

Fumihito Arai, Toshio Fukuda · 2002 · 42 citations

, , +13

The Black Silicon Method V: A Study Of The Fabricating Of Movable Structures For Micro Electromechanical Systems

M. de Boer, Henri Jansen · Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95 · 2005 · 40 citations · Full text

, , +17

1–5 of 24

Authors

77

  1. CK
    Chang‐Jin Kim

    University of California, Los Angeles, United States

    3 publications · 205 citations

    3

    h-index

  2. BG
    Bedanta Gogoi

    Institute of Advanced Study in Science and Technology, India

    2 publications · 47 citations

    2

    h-index

  3. JH
    James H. Smith

    Sandia National Laboratories California, United States

    2 publications · 37 citations

    2

    h-index

  4. CH
    Carlos H. Mastrangelo

    University of Michigan, United States

    2 publications · 47 citations

    2

    h-index

  5. TF
    Toshio Fukuda

    Nagoya University, Japan

    2 publications · 71 citations

    2

    h-index

1–5 of 77

Institutions

28

  1. University of California, Los Angeles

    Los Angeles, United States

    2 h-index

    2 publications

    147 citations

  2. University of Michigan

    Ann Arbor, United States

    2 h-index

    4 publications

    94 citations

  3. University of Twente

    Enschede, The Netherlands

    2 h-index

    8 publications

    285 citations

  4. Nagoya University

    Nagoya, Japan

    2 h-index

    4 publications

    142 citations

  5. Pusan National University

    Busan, South Korea

    1 h-index

    1 publications

    10 citations

  6. University of California, Berkeley

    Berkeley, United States

    1 h-index

    1 publications

    11 citations

  7. Central Electronics Engineering Research Institute

    Pilāni, India

    1 h-index

    8 publications

    144 citations

  8. Electronics and Telecommunications Research Institute

    Daejeon, South Korea

    1 h-index

    5 publications

    580 citations

1–8 of 28

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 4 publications · 65 citations

    4

    h-index

  2. 4

    h-index

  3. 2

    h-index

  4. Journal of Microelectromechanical Systems

    2 publications · 153 citations

    2

    h-index

  5. 1

    h-index

1–5