Substrate Interconnects
Substrate Interconnects is a physical integration technology that, as an interconnect architecture, routes electrical signals and power between semiconductor devices and external packaging through conductive pathways embedded within a dielectric substrate.
58
Publications
2.3K
Citations
210
Authors
66
Institutions
Publications per year
2017–2026
6
Parents
58
Maurizio Bozzi, Luca Perregrini, Ke Wu · IEEE Transactions on Microwave Theory and Techniques · 2008 · 185 citations
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66
Georgia Institute of Technology
Atlanta, United States
11 h-index
36 publications
885 citations

Polytechnique Montréal
Montreal, Canada
7 h-index
10 publications
635 citations
University of Pavia
Pavia, Italy
5 h-index
13 publications
598 citations
IBM (United States)
Armonk, United States
3 h-index
3 publications
113 citations
IBM Research - Thomas J. Watson Research Center
Yorktown Heights, United States
3 h-index
6 publications
316 citations

McGill University
Montreal, Canada
3 h-index
6 publications
248 citations
Qualcomm (United States)
San Diego, United States
2 h-index
5 publications
171 citations
University of Illinois Urbana-Champaign
Urbana, United States
2 h-index
14 publications
4.3K citations
1–8 of 66
3 publications · 263 citations
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3 publications · 121 citations
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JES · 2 publications · 55 citations
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2 publications · 52 citations
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2 publications · 105 citations
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