Concepedia

Polymer-based Packaging

Polymer-Based Packaging is a type of MEMS packaging that utilizes polymeric materials as the primary structural and encapsulating medium to provide mechanical support, environmental protection, and electrical insulation for microelectromechanical systems.

120

Publications

7.4K

Citations

536

Authors

196

Institutions

Publications per year

2017–2026

35

Parents

Publications

120

Food packaging based on polymer nanomaterials

Clara Silvestre, Donatella Duraccio, Sossio Cimmino · Progress in Polymer Science · 2011 · 922 citations

, , +14

Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

Zhan Liu, Junhui Li, Xiaohe Liu · ACS Applied Materials & Interfaces · 2020 · 500 citations

, , +15

Eco-friendly polymer composites for green packaging: Future vision and challenges

Hesham Moustafa, Ahmed M. Youssef, N. A. Darwish et al. · Composites Part B Engineering · 2019 · 377 citations

, , +16

Structural characteristics defining high barrier properties in polymeric materials

José M. Lagarón, Rafael Catalá, Rafael Gavara · Materials Science and Technology · 2004 · 347 citations

, , +17

Recent advances in polymers and polymer composites for food packaging

Mingyue Zhang, Gill M. Biesold, Woosung Choi et al. · Materials Today · 2022 · 314 citations

, , +16

1–5 of 120

Authors

536

  1. HR
    H. Reichl

    Fraunhofer Institute for Reliability and Microintegration, Germany

    3 publications · 121 citations

    3

    h-index

  2. RG
    Rafael Gavara

    Instituto de Agroquímica y Tecnología de Alimentos, Spain

    3 publications · 868 citations

    3

    h-index

  3. WL
    Wanshuang Liu

    Donghua University, China

    2 publications · 133 citations

    2

    h-index

  4. CS
    Clara Silvestre

    Institute of Polymers, Composites and Biomaterials, Italy

    2 publications · 1.2K citations

    2

    h-index

  5. EA
    Eva Almenar

    Michigan State University, United States

    2 publications · 521 citations

    2

    h-index

1–5 of 536

Institutions

196

  1. Chinese Academy of Sciences

    Beijing, China

    6 h-index

    37 publications

    2.4K citations

  2. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    4 h-index

    12 publications

    507 citations

  3. Technische Universität Berlin

    Berlin, Germany

    3 h-index

    5 publications

    116 citations

  4. Nanyang Technological University

    Singapore, Singapore

    2 h-index

    5 publications

    204 citations

  5. Donghua University

    Shanghai, China

    2 h-index

    6 publications

    130 citations

  6. Nottingham Trent University

    Nottingham, United Kingdom

    2 h-index

    5 publications

    240 citations

  7. National University of Singapore

    Singapore, Singapore

    2 h-index

    3 publications

    81 citations

  8. Jiangnan University

    Wuxi, China

    2 h-index

    12 publications

    336 citations

1–8 of 196

Venues

  1. Polymer

    3 publications · 161 citations

    3

    h-index

  2. European Polymer Journal

    EPJ · 3 publications · 183 citations

    3

    h-index

  3. Microelectronics Reliability

    3 publications · 66 citations

    3

    h-index

  4. 3

    h-index

  5. Thin Solid Films

    2 publications · 119 citations

    2

    h-index

1–5